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Nov 24 / 10:45pm

Difference between Common Cold & H1N1

H1N1 flu is about to be upon us and we need to be on top of information regarding it. Here is a comparison to the normal cold symptoms.

Know the Difference between a Cold and H1N1 Flu Symptoms

Symptom	Cold	H1N1 Flu
Fever	Fever is rare with a cold.	Fever is usually present with the flu in up to 80% of all flu cases. A temperature of 100 °F or higher for 3 to 4 days is associated with the H1N1 flu.
Coughing	A hacking, productive (mucus- producing) cough is often present with a cold.	A non-productive (non-mucus producing) cough is usually present with the H1N1 flu (sometimes referred to as dry cough).
Aches	Slight body aches and pains can be part of a cold.	Severe aches and pains are common with the H1N1 flu.
Stuffy Nose	Stuffy nose is commonly present with a cold and typically resolves spontaneously within a week.	Stuffy nose is not commonly present with the H1N1 flu.
Chills	Chills are uncommon with a cold.	60% of people who have the H1N1 flu experience chills.
Tiredness	Tiredness is fairly mild with a cold.	Tiredness is moderate to severe with the H1N1 flu.
Sneezing	Sneezing is commonly present with a cold.	Sneezing is not common with the H1N1 flu.
Sudden Symptoms	Cold symptoms tend to develop over a few days.	The H1N1 flu has a rapid onset within 3-6 hours. The flu hits hard and includes sudden symptoms like high fever, aches and pains.
Headache	A headache is fairly uncommon with a cold.	A headache is very common with the H1N1 flu, present in 80% of flu cases.
Sore Throat	Sore throat is commonly present with a cold.	Sore throat is not commonly present with the H1N1 flu.
Chest Discomfort	Chest discomfort is mild to moderate with a cold.	Chest discomfort is often severe with the H1N1 flu.

The only way to stop the spread of the epidemic is to spread the awareness.

Comments (2)

Oct 16 / 5:32am

Tamil Valka - தமிள் வால்க

வால்க வாள்க வே...!

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Sep 30 / 5:15am

Intel Shows How A CPU Is Made - Amazing process

Very interesting...

Sand. Made up of 25 percent silicon, is, after oxygen, the second most abundant chemical element that's in the earth's crust. Sand, especially quartz, has high percentages of silicon in the form of silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.

After procuring raw sand and separating the silicon, the excess material is disposed of and the silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon. The resulting purity is so great that electronic grade silicon may only have one alien atom for every one billion silicon atoms. After the purification process, the silicon enters the melting phase. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono-crystal is called an ingot.

A mono-crystal ingot is produced from electronic grade silicon. One ingot weighs approximately 100 kilograms (or 220 pounds) and has a silicon purity of 99.9999 percent.

The ingot is then moved onto the slicing phase where individual silicon discs, called wafers, are sliced thin. Some ingots can stand higher than five feet. Several different diameters of ingots exist depending on the required wafer size. Today, CPUs are commonly made on 300 mm wafers.

Once cut, the wafers are polished until they have flawless, mirror-smooth surfaces. Intel doesn't produce its own ingots and wafers, and instead purchases manufacturing-ready wafers from third-party companies. Intel�s advanced 45 nm High-K/Metal Gate process uses wafers with a diameter of 300 mm (or 12-inches). When Intel first began making chips, it printed circuits on 50 mm (2-inches) wafers. These days, Intel uses 300 mm wafers, resulting in decreased costs per chip.

The blue liquid, depicted above, is a photo resist finish similar to those used in film for photography. The wafer spins during this step to allow an evenly-distributed coating that's smooth and also very thin.

At this stage, the photo-resistant finish is exposed to ultra violet (UV) light. The chemical reaction triggered by the UV light is similar to what happens to film material in a camera the moment you press the shutter button.

Areas of the resist on the wafer that have been exposed to UV light will become soluble. The exposure is done using masks that act like stencils. When used with UV light, masks create the various circuit patterns. The building of a CPU essentially repeats this process over and over until multiple layers are stacked on top of each other.

A lens (middle) reduces the mask's image to a small focal point. The resulting "print" on the wafer is typically four times smaller, linearly, than the mask's pattern.

In the picture we have a representation of what a single transistor would appear like if we could see it with the naked eye. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that they claim roughly 30 million of them could fit on the head of a pin.

After being exposed to UV light, the exposed blue photo resist areas are completely dissolved by a solvent. This reveals a pattern of photo resist made by the mask. The beginnings of transistors, interconnects, and other electrical contacts begin to grow from this point.

The photo resist layer protects wafer material that should not be etched away. Areas that were exposed will be etched away with chemicals.

After the etching, the photo resist is removed and the desired shape becomes visible.

More photo resist (blue) is applied and then re-exposed to UV light. Exposed photo resist is then washed off again before the next step, which is called ion doping. This is the step where ion particles are exposed to the wafer, allowing the silicon to change its chemical properties in a way that allows the CPU to control the flow of electricity.

Through a process called ion implantation (one form of a process called doping) the exposed areas of the silicon wafer are bombarded with ions. Ions are implanted in the silicon wafer to alter the way silicon?i these areas conduct electricity. Ions are propelled onto the surface of the wafer at very high velocities. An electrical field accelerates the ions to a speed of over 300,000 km/hour (roughly 185,000 mph)

After the ion implantation, the photo resist will be removed and the material that should have been doped (green) now has alien atoms implanted.

This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper, which will make up the connections to other transistors.

The wafers are put into a copper sulphate solution at this stage. Copper ions are deposited onto the transistor through a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.

The copper ions settle as a thin layer on the wafer surface.

The excess material is polished off leaving a very thin layer of copper.

Multiple metal layers are created to interconnects (think wires) in between the various transistors. How these connections have to be �wired� is determined by the architecture and design teams that develop the functionality of the respective processor (for example, Intel�s Core i7 processor). While computer chips look extremely flat, they may actually have over 20 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that look like a futuristic, multi-layered highway system.

This fraction of a ready wafer is being put through a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to "the right answer."

After tests determine that the wafer has a good yield of functioning processor units, the wafer is cut into pieces (called dies).

The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging). Bad dies are discarded. Several years ago, Intel made key chains out of bad CPU dies.

This is an individual die, which has been cut out in the previous step (slicing). The die shown here is a die of an Intel Core i7 processor.

The substrate, the die, and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be applied. This will keep the processor cool during operation.

A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps and only the most important ones have been visualized in this picture story.

During this final test the processors will be tested for their key characteristics (among the tested characteristics are power dissipation and maximum frequency).

Based on the test result of class testing processors with the same capabilities are put into the same transporting trays. This process is called "binning". Binning determines the maximum operating frequency of a processor, and batches are divided and sold according to stable specifications.

The manufactured and tested processors (again Intel Core i7 processor is shown here) either go to system manufacturers in trays or into retail stores in a box. Many thanks to Intel for supplying the text and photos in this picture story. Check out Intel's site for full size images of this entire process.

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Sep 25 / 4:58am

Airtel Sri Lanka on Dialog's path - Atleast in Spamming...!

Airtel want to succeed like Dialog in the Sri Lankan market, and they have started following Dialog's activities, atleast in SPAMMING....!!!

(I tried getting an explanation from Bharti Airtel Lanka (Pvt) Ltd, but didn't get any reply withing 72 hours.)

---------- Forwarded message ----------
From: Nimal
Date: Tue, Sep 22, 2009 at 7:03 PM
Subject: Fwd: High Speed Broadband
To: 555@airtel.lk, Vidur.Rattan@airtel.lk

Attn:

Mr. Vidur Rattan Head - Sales and Marketing

Bharti Airtel Lanka (Pvt) Ltd

Dear Mr. Rattan,

I'm writing this in reference to the following "promotional email" from Bharti Airtel Lanka (Pvt) Ltd, that is sent through some "En-V Productions".

I consider this as a violation of privacy and spamming, This email is considered a spam, because I have not given out my email to either Airtel or En-V Productions for this kind of usage. Further this email does not provide a way to opt-out from this email list, thus this cannot be considered as a acceptable use. I'm bringing this to your attention, as we do not expect respectable businesses like Bharti Airtel, to rely on spammers and email scrappers for marketing purposes.

I will be posting this on to my blog as I did for couple of previous emails from Dialog, which was also sent using the same "spamming service provider". I'm open to accommodate any explanations from Bharti Airtel Lanka (Pvt) Ltd. on this matter.

Thank you.

Regards,

Nimal

---------- Forwarded message ----------
From: Airtel News <1988dam@gmail.com>
Date: Tue, Sep 22, 2009 at 11:12 AM
Subject: High Speed Broadband
To:

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Sep 24 / 1:58am

[Sri Lankan SPAM] Fwd: THINPEACE

---------- Forwarded message ----------
From: Win Cash - Lose Weight <1988dam@gmail.com>
Date: Wed, Sep 23, 2009 at 9:54 PM
Subject: THINPEACE
To:

Comments (0)

Sep 24 / 1:55am

Living in 2009 - Ridiculously True

YOU KNOW YOU ARE LIVING IN 2009 when...

1. You accidentally enter your password on the microwave.

2. You haven't played solitaire with real cards in years.

3. You have a list of 15 phone numbers to reach your family of 3.

4. You e-mail the person who works at the desk next to you.

5. Your reason for not staying in touch with friends and family is that they don't have e-mail addresses.

6. You pull up in your own driveway and use your cell phone to see if anyone is home to help you carry in the groceries.

7. Every commercial on television has a web site at the bottom of the screen.

8. Leaving the house without your cell phone, which you didn't have the first 20 or 30 (or 60) years of your life, is now a cause for panic and you turn around to go and get it.

10. You get up in the morning and go on line before getting your coffee.

11. You start tilting your head sideways to smile. :)

12 You're reading this and nodding and laughing.

13. Even worse, you know exactly to whom you are going to forward this message.

14. You are too busy to notice there was no #9 on this list.

15. You actually scrolled back up to check that there wasn't a #9 on this list.

AND NOW YOU ARE LAUGHING at yourself.

Comments (0)

Sep 18 / 9:28am

Dialog Telecom Sri Lanka Spamming Me...!

This is how I got a SPAM for the Dialog TV product of Dialog Telekom PLC.

Some people might say this might have been from some elements against Dialog, with the intention of damaging Dialog's reputation. But could that be...? I don't think this could happen without the proper consent of its higher marketing. The 'company' En-V Productions which has sent this mail seems to operate as a bulk mail sending service,who charge for the number of emails they can send in bulk.

This what is called doing business in the correct way??? I would say this is insane, and I don't expect this kind of cheap marketing tactics of SPAMMING from businesses of this nature, who claim they bring pride to the nation...!!!

---------- Forwarded message ----------
From: Dialog TV Bonanza <1988dam@gmail.com>
Date: Wed, Sep 16, 2009 at 2:01 PM
Subject: Rs. 50,000 FREE
To: